Copper Molybdenum, Copper Tungsten Heat Dissipation Material - Low Thermal Expansion, High Thermal Conductivity
High-quality copper-molybdenum and copper-tungsten heat sinks with low thermal expansion and high thermal conductivity.
Materials like Cu and Al, which are widely used in heat sinks, have high thermal expansion coefficients, leading to reliability issues in high-spec products. Planzé optimally controls the thermal expansion coefficients and thermal conductivities of copper-molybdenum and copper-tungsten at a high level to manufacture ideal heat radiators. Using advanced powder metallurgy, we achieve material properties close to your desired values.
- Company：プランゼージャパン
- Price：Other
